I-Silicon Carbide Substrates | Ii-Wafers zeSiC

Inkcazelo emfutshane:

I-Semicera Energy Technology Co., Ltd. ngumboneleli okhokelayo okhethekileyo kwi-wafer kunye ne-semiconductor consumables ephezulu. Sizinikezele ekunikezeni umgangatho ophezulu, othembekileyo, kunye neemveliso ezintsha kwimveliso ye-semiconductor, imboni ye-photovoltaic kunye nezinye iindawo ezinxulumene nazo.

Umgca wethu wemveliso uquka i-SiC/TaC egqunywe ngeemveliso zegraphite kunye neemveliso ze-ceramic, ezibandakanya izinto ezahlukeneyo ezifana ne-silicon carbide, i-silicon nitride, kunye ne-aluminium oxide kunye nokunye.

Okwangoku, sikuphela komvelisi obonelela ngobunyulu be-99.9999% ye-SiC yokwambathisa kunye ne-99.9% ye-silicon carbide ehlaziyiweyo. Ubude obuphezulu bokugquma kweSiC sinokwenza i-2640mm.

 

Iinkcukacha zeMveliso

Iithegi zeMveliso

I-SiC-Wafer

I-Silicon carbide (SiC) imathiriyeli yekristale enye inobubanzi bebhendi enkulu (~Si 3 amaxesha), i-thermal conductivity ephezulu (~Si 3.3 amaxesha okanye GaAs 10 amaxesha), izinga eliphezulu lokufuduka kwe-electron (~Si 2.5 amaxesha), ukuphuka okuphezulu kombane intsimi (~ Si 10 amaxesha okanye GaAs 5 amaxesha) kunye nezinye iimpawu ezibalaseleyo.

Izixhobo ze-SiC zineenzuzo ezingenakubuyiselwa kwindawo yobushushu obuphezulu, uxinzelelo oluphezulu, amaza ombane aphezulu, izixhobo zombane ezinamandla aphezulu kunye nokusetyenziswa okugqithisileyo kokusingqongileyo okunje nge-aerospace, umkhosi, amandla enyukliya, njl. izicelo, kwaye ngokuthe ngcembe ziye zaba zezona ziphambili zeesemiconductors zamandla.

Iimpawu ze-4H-SiC Silicon carbide substrate

Into项目

Iinkcukacha参数

Iipolytype
晶型

4H -SiC

6H-SiC

Ububanzi
晶圆直径

2 intshi | 3 intshi | 4 intshi | 6intshi

2 intshi | 3 intshi | 4 intshi | 6intshi

Ukutyeba
厚度

330 μm ~ 350 μm

330 μm ~ 350 μm

Ukuqhuba
导电类型

N – uhlobo / Semi-insulating
N型导电片/ 半绝缘片

N – uhlobo / Semi-insulating
N型导电片/ 半绝缘片

I-Dopant
掺杂剂

N2 ( Nitrogen )V ( Vanadium )

N2 ( Nitrogen ) V ( Vanadium )

Ukuqhelaniswa
晶向

Kwi-axis <0001>
I-off axis <0001> off 4 °

Kwi-axis <0001>
I-off axis <0001> off 4 °

Ukuxhathisa
电阻率

0.015 ~ 0.03 ohm-cm
(4H-N)

0.02 ~ 0.1 ohm-cm
(6H-N)

Uxinaniso lweMibhobho (MPD)
微管密度

≤10/cm2 ~ ≤1/cm2

≤10/cm2 ~ ≤1/cm2

TTV
总厚度变化

≤ 15 μm

≤ 15 μm

Isaphetha / Warp
翘曲度

≤25 μm

≤25 μm

Umphezulu
表面处理

DSP/SSP

DSP/SSP

IBanga
产品等级

Ibanga leMveliso / loPhando

Ibanga leMveliso / loPhando

Crystal Stacking Ulandelelwano
堆积方式

ABCB

ABCABC

Iparamitha yeLattice
晶格参数

a=3.076A , c=10.053A

a=3.073A , c=15.117A

Umzekelo/eV(Band-gap)
禁带宽度

3.27 eV

3.02 eV

ε(Dielectric Constant)
介电常数

9.6

9.66

Refraction Index
折射率

n0 =2.719 ne =2.777

n0 =2.707 , ne =2.755

Iimpawu ze-6H-SiC Silicon Carbide substrate

Into项目

Iinkcukacha参数

Iipolytype
晶型

6H-SiC

Ububanzi
晶圆直径

4 intshi | 6intshi

Ukutyeba
厚度

350μm ~ 450μm

Ukuqhuba
导电类型

N – uhlobo / Semi-insulating
N型导电片/ 半绝缘片

I-Dopant
掺杂剂

N2( Nitrogen)
V ( Vanadium )

Ukuqhelaniswa
晶向

<0001> off 4 ° ± 0.5 °

Ukuxhathisa
电阻率

0.02 ~ 0.1 ohm-cm
(Udidi lwe-6H-N)

Uxinaniso lweMibhobho (MPD)
微管密度

≤ 10/cm2

TTV
总厚度变化

≤ 15 μm

Isaphetha / Warp
翘曲度

≤25 μm

Umphezulu
表面处理

Si Ubuso: CMP, Epi-Ready
C Ubuso: I-Optical Polish

IBanga
产品等级

Ibakala lophando

Semicera Indawo yokusebenzela Indawo yokusebenza yeSemicera 2 Umatshini wezixhobo Ukucutshungulwa kwe-CNN, ukucocwa kweekhemikhali, ukugquma kwe-CVD Inkonzo yethu


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