I-Wafer ye-SOI ye-Semicera (i-Silicon kwi-Insulator) yenzelwe ukuhambisa ukohlula kombane okuphezulu kunye nokusebenza kwe-thermal. Olu lwakhiwo lwe-wafer lusungulayo, lunomaleko wesilicon kumaleko wokugquma, luqinisekisa ukusebenza okuphuculweyo kwesixhobo kunye nokuncipha kokusetyenziswa kwamandla, oko kusenza ukuba silungele usetyenziso oluhlukeneyo lobuchwepheshe obuphezulu.
Ii-wafers zethu ze-SOI zibonelela ngeenzuzo ezikhethekileyo kwiisekethe ezidibeneyo ngokunciphisa amandla e-parasitic kunye nokuphucula isantya kunye nokusebenza kakuhle kwesixhobo. Oku kubalulekile kwii-electronics zanamhlanje, apho ukusebenza okuphezulu kunye nokusebenza kakuhle kwamandla kubalulekile kubo bobabini usetyenziso kunye nefektri.
I-Semicera isebenzisa ubuchule obuphambili bokuvelisa ukuvelisa ii-wafers ze-SOI ezinomgangatho ongaguqukiyo kunye nokuthembeka. Ezi wafers zibonelela ngokugqwesileyo kokugquma kwe-thermal, zizenza zilungele ukusetyenziswa kwindawo apho ukutshatyalaliswa kobushushu kuyinkxalabo, njengakwizixhobo zombane ezixinana kakhulu kunye neenkqubo zolawulo lwamandla.
Ukusetyenziswa kwee-wafers ze-SOI kwi-semiconductor fabrication ivumela ukuphuhliswa kweechips ezincinci, ezikhawulezayo kunye nezithembekileyo. Ukuzibophelela kweSemicera kubunjineli obuchanekileyo kuqinisekisa ukuba ii-wafers zethu ze-SOI ziyahlangabezana nemigangatho ephezulu efunekayo kubuchwephesha obukwinqanaba eliphezulu kwiinkalo ezifana nezonxibelelwano, iimoto, kunye nombane wabathengi.
Ukukhetha i-SOI Wafer ye-Semicera ithetha ukutyala imali kwimveliso exhasa ukuqhubela phambili kobuchwepheshe be-elektroniki kunye ne-microelectronic. Ii-wafers zethu ziyilelwe ukubonelela ukusebenza okuphuculweyo kunye nokuqina, igalelo kwimpumelelo yeeprojekthi zakho zobuchwepheshe obuphezulu kunye nokuqinisekisa ukuba uhlala uphambili ekuveliseni izinto ezintsha.
| Izinto | Imveliso | Uphando | Dummy |
| Iiparamitha zeCrystal | |||
| Iipolytype | 4H | ||
| Imposiso yokuma kumphezulu | <11-20>4±0.15° | ||
| Iiparamitha zoMbane | |||
| I-Dopant | n-uhlobo lweNitrojeni | ||
| Ukuxhathisa | 0.015-0.025ohm · cm | ||
| Iiparamitha zoomatshini | |||
| Ububanzi | 150.0±0.2mm | ||
| Ukutyeba | 350±25 μm | ||
| Ukuqhelaniswa neflethi ephambili | [1-100] ± 5 ° | ||
| Ubude beflethi bokuqala | 47.5±1.5mm | ||
| Iflethi yesibini | Akukho nanye | ||
| TTV | ≤5 μm | ≤10 μm | ≤15 μm |
| LTV | ≤3 μm(5mm*5mm) | ≤5 μm(5mm*5mm) | ≤10 μm(5mm*5mm) |
| Ukuqubuda | -15μm ~ 15μm | -35μm ~ 35μm | -45μm ~ 45μm |
| I-Wap | ≤35 μm | ≤45 μm | ≤55 μm |
| Ngaphambili(Si-face) uburhabaxa(AFM) | Ra≤0.2nm (5μm*5μm) | ||
| Ulwakhiwo | |||
| Ukuxinana kweMibhobho | <1 iya/cm2 | <10 i/cm2 | <15 i/cm2 |
| Ukungcola kwesinyithi | ≤5E10athom/cm2 | NA | |
| I-BPD | ≤1500 i-ea/cm2 | ≤3000 nge-cm2 | NA |
| TSD | ≤500 i/cm2 | ≤1000 nge-cm2 | NA |
| Umgangatho wangaphambili | |||
| Ngaphambili | Si | ||
| Ukugqitywa komphezulu | Si-ubuso CMP | ||
| Amacandelo | ≤60ea/wafer (ubukhulu≥0.3μm) | NA | |
| Imikrwelo | ≤5ea/mm. Ubude obongezelekayo ≤Ububanzi | Ubude obongezelekayo≤2*Ububanzi | NA |
| Amaxolo e-orenji/imingxuma/amabala/imivimbo/ iintanda/ungcoliseko | Akukho nanye | NA | |
| Iitshiphusi ze-Edge/i-idents/fracture/hex plates | Akukho nanye | ||
| Iindawo zePolytype | Akukho nanye | Indawo eyongezelekayo≤20% | Indawo eyongezelekayo≤30% |
| Ukumakishwa kwelaser yangaphambili | Akukho nanye | ||
| Umgangatho wasemva | |||
| Emva kokugqiba | C-ubuso CMP | ||
| Imikrwelo | ≤5ea/mm,Ubude obongezelekayo≤2*Ububanzi | NA | |
| Iziphene zangasemva (iitshiphusi zomphetho/iindindi) | Akukho nanye | ||
| Umqolo uburhabaxa | Ra≤0.2nm (5μm*5μm) | ||
| Ukumakishwa kwelaser yangasemva | 1 mm (ukusuka kumphetho ophezulu) | ||
| Edge | |||
| Edge | Chamfer | ||
| Ukupakishwa | |||
| Ukupakishwa | I-Epi ilungele ukupakishwa kwevacuum Ukupakishwa kweekhasethi ezininzi | ||
| *Amanqaku: "NA" ithetha ukuba akukho sicelo Izinto ezingakhankanywanga zinokubhekisa kwi-SEMI-STD. | |||
