I-high-precision machining yemibhobho kunye namacwecwe aqhutyelwa ngokusebenzisa oomatshini bokugaya, abanakho ukuphatha iimilo ezinzima.
Ingasetyenziselwa iinkqubo ezahlukeneyo zomatshini ezifana ne-contouring, slotting, kunye nokuthunga kweglasi yequartz kunye neglasi enzima.
Isetyenziswa njenge-bonding kunye ne-wafer fixtures kwiinkqubo ze-semiconductor.