Ngawaphi amanyathelo aphambili ekusetyenzweni kweesubstrates zeSiC?

 

Siwavelisa njani amanyathelo okulungisa ama-substrates e-SiC ngolu hlobo lulandelayo:

 

1. Ukuqhelaniswa neCrystal:

Ukusebenzisa i-X-ray diffraction ukuqhelanisa i-crystal ingot. Xa umqadi we-X-ray uqondiswe kubuso obunqwenelekayo bekristale, i-angle ye-diffracted beam imisela i-crystal orientation.

 

2. UkuSila kwiDayimitha yaNgaphandle:

Iikristale zodwa ezikhuliswe kwiicrucible zegraphite zihlala zidlula iidiameter eziqhelekileyo. Ukusila kwedayimitha yangaphandle kuyabanciphisa kubungakanani obuqhelekileyo.

 

 

3.Phelisa ukuSila ngobuso:

I-4-intshi ye-4H-SiC substrates idla ngokuba neendawo ezimbini zokumisa, eziphambili kunye nesekondari. Ukuphelisa ubuso bokusila kuvula le miphetho yokumisa.

 

4. Ukusarha ucingo:

Ukusarha ngocingo linyathelo elibalulekileyo ekusetyenzweni kwe-4H-SiC substrates. Ukuqhekeka kunye nomonakalo ongaphantsi komhlaba owenziwe ngexesha lokusarha ucingo luchaphazela kakubi iinkqubo ezilandelayo, ukwandisa ixesha lokucubungula kunye nokubangela ukulahleka kwezinto. Eyona ndlela ixhaphakileyo yi-multi-wire sawing kunye ne-diamond abrasive. Ukunyakaza okuphindaphindiweyo kweengcingo zetsimbi eziboshwe nge-diamond abrasives zisetyenziselwa ukusika i-ingot ye-4H-SiC.

 

5. Ukukhohlisa:

Ukuthintela ukutshitshwa komphetho kunye nokunciphisa ilahleko enokutyiwa ngexesha leenkqubo ezilandelayo, imiphetho ebukhali yeetshiphusi ezisarha ngocingo zitsalwa kwiimilo ezichaziweyo.

 

6. Ukubhitya:

Ukusarha ngocingo kushiya imikrwelo emininzi kunye nomonakalo ongaphantsi komhlaba. Ukucwenga kwenziwa kusetyenziswa amavili edayimani ukususa ezi ziphene kangangoko kunokwenzeka.

 

7. Ukucola:

Le nkqubo iquka ukucola nokusila ngokucokisekileyo kusetyenziswa ibhoron carbide encinci okanye iziqhoboshi zedayimane ukususa umonakalo oshiyekileyo kunye nomonakalo omtsha owenziwe ngexesha lokucolwa.

 

8. Ukugudisa:

Amanyathelo okugqibela abandakanya ukupolisha okurhabaxa kunye nokupholiswa kakuhle kusetyenziswa ialumina okanye isilicon oxide abrasives. Ulwelo lokupholisha luthambisa umphezulu, oluthi ke lususwe ngoomatshini ngama-abrasives. Eli nyathelo liqinisekisa indawo egudileyo kwaye engonakali.

 

9. Ukucoca:

Ukususa iincinci, isinyithi, iifilimu ze-oxide, i-organic residues, kunye nezinye izinto ezingcolileyo ezishiywe kumanyathelo okucubungula.