Ngawaphi amanyathelo aphambili ekusetyenzweni kweesubstrates zeSiC?

Siwavelisa njani amanyathelo okulungisa ama-substrates e-SiC ngolu hlobo lulandelayo:

1. I-Crystal Orientation: Ukusebenzisa i-X-ray diffraction ukuqhelanisa i-crystal ingot. Xa umqadi we-X-ray uqondiswe kubuso obunqwenelekayo bekristale, i-angle ye-diffracted beam imisela i-crystal orientation.

2. I-Outer Diameter Grinding: Iikristale enye ekhule kwiicrucibles zegraphite zihlala zidlula iidiameter eziqhelekileyo. Ukusila kwedayimitha yangaphandle kuyabanciphisa kubungakanani obuqhelekileyo.

 

I-3.Ukuphela koBuso bokuSila: I-4-intshi ye-4H-SiC substrates ngokuqhelekileyo inamaphethelo amabini okumisa, okuphambili kunye nesekondari. Ukugqiba ukusila kobuso kuvula le miphetho yokumisa.

4. Ukusarha ucingo: Ukusarha ngocingo linyathelo elibalulekileyo ekusetyenzweni kwe-4H-SiC substrates. Ukuqhekeka kunye nomonakalo ongaphantsi komhlaba owenziwe ngexesha lokusarha ucingo luchaphazela kakubi iinkqubo ezilandelayo, ukwandisa ixesha lokucubungula kunye nokubangela ukulahleka kwezinto. Eyona ndlela ixhaphakileyo yi-multi-wire sawing nge-diamond abrasive. Ukunyakaza okuphindaphindiweyo kweengcingo zetsimbi eziboshwe nge-diamond abrasives zisetyenziselwa ukusika i-ingot ye-4H-SiC.

5. I-Chamfering: Ukuthintela i-edge chipping kunye nokunciphisa ilahleko esetyenziswayo ngexesha leenkqubo ezilandelayo, i-edges ebukhali yeetshiphu ze-wire-sawn chamfered kwiimilo ezichaziweyo.

6. Ukucwenga: Ukusarha ngocingo kushiya imikrwelo emininzi kunye nomonakalo ongaphantsi komphezulu. Ukucwenga kwenziwa kusetyenziswa amavili edayimani ukususa ezi ziphene kangangoko kunokwenzeka.

7. Ukusila: Le nkqubo ibandakanya ukugawula okurhabaxa kunye nokucolwa kusetyenziswa i-boron carbide encinci okanye i-diamond abrasives ukususa umonakalo oshiyekileyo kunye nomonakalo omtsha owenziwe ngexesha lokunciphisa.

8. Ukupholisha: Amanyathelo okugqibela abandakanya ukupolisha okurhabaxa kunye nokupholisha kakuhle kusetyenziswa ialumina okanye isilicon oxide abrasives. Ulwelo lokupholisha luthambisa umphezulu, oluthi ke lususwe ngoomatshini ngama-abrasives. Eli nyathelo liqinisekisa indawo egudileyo kwaye engonakali.

9. Ukucoca: Ukususa iincinci, isinyithi, iifilimu ze-oxide, i-organic residues, kunye nezinye izinto ezingcolileyo ezishiywe kumanyathelo okucubungula.