Ukucoceka kweumphezulu we-waferiya kuchaphazela kakhulu ireyithi yesiqinisekiso seenkqubo ezilandelayo zesemiconductor kunye neemveliso. Ukuya kuthi ga kwi-50% yazo zonke iilahleko zesivuno ezibangelwaumphezulu we-waferungcoliso.
Izinto ezinokubangela utshintsho olungalawulwayo ekusebenzeni kombane wesixhobo okanye inkqubo yokwenziwa kwesixhobo zibizwa ngokudibeneyo njengezingcolisi. Ukungcola kunokuvela kwi-wafer ngokwayo, igumbi elicocekileyo, izixhobo zokusebenza, iikhemikhali zenkqubo okanye amanzi.WaferUngcoliseko lunokubonwa ngokubanzi ngokujongwa okubonwayo, ukuhlolwa kwenkqubo, okanye ukusetyenziswa kwezixhobo zohlalutyo ezintsonkothileyo kuvavanyo lokugqibela lwesixhobo.
▲Izingcolisi kumphezulu wesilicon wafers | Umthombo womfanekiso womnatha
Iziphumo zokuhlalutya ungcoliseko zingasetyenziselwa ukubonisa iqondo kunye nohlobo longcoliseko oludibana naloiqhekezana lesonkakwinyathelo lenkqubo ethile, umatshini othile okanye inkqubo iyonke. Ngokohlelo lweendlela zokufumanisa,umphezulu we-waferungcoliseko lunokwahlulwa ngokwezi ntlobo zilandelayo.
Ukungcoliswa kwesinyithi
Ungcoliseko olubangelwa zisinyithi lunokubangela iziphene zesixhobo se-semiconductor zamaqondo ahlukeneyo.
Isinyithi se-alkali okanye i-alkaline yomhlaba isinyithi (i-Li, Na, K, Ca, Mg, Ba, njl.) inokubangela ukuvuza kwangoku kwisakhiwo se-pn, nto leyo ekhokelela ekuqhekekeni kombane we-oxide; inguqu yesinyithi kunye nentsimbi enzima (i-Fe, i-Cr, i-Ni, i-Cu, i-Au, i-Mn, i-Pb, njl.) Ukungcola kunokunciphisa umjikelezo wobomi bomthwali, ukunciphisa ubomi benkonzo yecandelo okanye ukwandisa umbane omnyama xa icandelo lisebenza.
Iindlela eziqhelekileyo zokubona ungcoliseko lwesinyithi kukubonakaliswa okupheleleyo kweX-reyi fluorescence, i-athom yokufunxa ispectroscopy kunye ne-inductively coupled plasma mass spectrometry (ICP-MS).
▲ Ungcoliseko lomphezulu weWafer | ResearchGate
Ungcoliseko lwesinyithi lunokuvela kwii-reagents ezisetyenziselwa ukucoca, i-etching, i-lithography, i-deposition, njl., okanye koomatshini abasetyenziswa kwinkqubo, njengee-oveni, i-reactors, implantation ye-ion, njl.
Usulelo lwesuntswana
Iidiphozithi zemathiriyeli ezizizo zikholisa ukujongwa ngokubona ukukhanya okuthe saa kwiziphene zomhlaba. Ke ngoko, elona gama lichanekileyo lezenzululwazi lokungcoliseka kwamasuntswana sisiphene sendawo yokukhanya. Ukungcoliswa kwe-particle kunokubangela ukuvala okanye ukufihla iziphumo kwiinkqubo ze-etching kunye ne-lithography.
Ngexesha lokukhula kwefilimu okanye ukufakwa, i-pinholes kunye ne-microvoids zenziwe, kwaye ukuba iinqununu zikhulu kwaye ziqhuba, zinokubangela iisekethe ezimfutshane.
▲ Ukwenziwa kongcoliseko lwamasuntswana | Umthombo womfanekiso womnatha
Ukungcoliswa kwamasuntswana amancinci kunokubangela izithunzi kumphezulu, njengexesha le-photolithography. Ukuba amaqhekeza amakhulu aphakathi kwe-photomask kunye ne-photoresist layer, anokunciphisa isisombululo soqhagamshelwano.
Ukongeza, banokuvimba i-ion ezikhawulezayo ngexesha lokufakelwa kwe-ion okanye ukufakwa okomileyo. Amacandelo anokuthi afakwe kwifilimu, ukwenzela ukuba kubekho amaqhuma kunye namaqhuma. Iileya ezifakwe emva koko zinokuqhekeka okanye zixhathise ukuqokelelana kwezi ndawo, kubangele iingxaki ngexesha lokuvezwa.
Ungcoliseko lwendalo
Ukungcola okuqukethe i-carbon, kunye nezakhiwo ezidibeneyo ezinxulumene ne-C, zibizwa ngokuba yi-organic contamination. Ungcoliseko lwendalo lunokubangela iipropati ezingalindelekanga ze-hydrophobic kwiumphezulu we-wafer, ukwandisa ubuninzi bomhlaba, ukuvelisa ubuso obumnyama, ukuphazamisa ukukhula kwe-epitaxial layer, kunye nokuchaphazela umphumo wokucoca ukungcola kwetsimbi ukuba ukungcola akususwe kuqala.
Ungcoliseko olunjalo lomphezulu lubonwa ngokubanzi ngezixhobo ezifana ne-thermal desorption MS, i-X-ray photoelectron spectroscopy, kunye ne-Auger electron spectroscopy.
▲Inethiwekhi yomthombo womfanekiso
Ungcoliseko lwegesi kunye nokungcoliseka kwamanzi
Iimolekyuli ze-atmospheric kunye nokungcoliseka kwamanzi kunye nobukhulu bemolekyuli zihlala zingasuswa ngumoya osebenzayo ophezulu we-particulate air (HEPA) okanye i-ultra-low penetration air filters (ULPA). Ungcoliseko olunjalo ludla ngokujongwa yi-ion mass spectrometry kunye ne-capillary electrophoresis.
Olunye ungcoliseko lunokuba ludidi oluninzi, umzekelo, amasuntswana anokuqulunqwa ngezinto eziphilayo okanye zetsimbi, okanye zombini, ngoko ke olu hlobo longcoliseko lunokwahlulwa njengolunye uhlobo.
▲Ungcoliseko lwemolekyuli yegesi | IONICON
Ukongeza, ukungcoliseka kwe-wafer kungaphinda kuhlelwe njengokungcoliswa kwemolekyuli, ukungcoliseka kwamasuntswana, kunye nenkqubo-ephuma kwi-debris contamination ngokobungakanani bomthombo wongcoliseko. Ubuncinci ubungakanani be-particle yongcoliseko, kunzima kakhulu ukuyisusa. Kwimveliso yecandelo le-elektroniki yanamhlanje, iinkqubo zokucoca i-wafer zenza i-30% - 40% yenkqubo yonke yokuvelisa.
▲Izingcolisi kumphezulu wesilicon wafers | Umthombo womfanekiso womnatha
Ixesha lokuposa: Nov-18-2024