Amanqaku aphambili oLawulo loMgangatho kwiNkqubo yokuPakisha iSemiconductorOkwangoku, iteknoloji yenkqubo yokupakishwa kwe-semiconductor iye yaphucuka kakhulu kwaye yalungiswa.Nangona kunjalo, ngokwembono epheleleyo, iinkqubo kunye neendlela zokupakishwa kwe-semiconductor azikafiki kweyona meko igqibeleleyo.Amacandelo ezixhobo ze-semiconductor abonakaliswe ngokuchaneka, okwenza amanyathelo enkqubo esisiseko kwimisebenzi yokupakisha ye-semiconductor entsonkothileyo.Ngokukodwa, ukuqinisekisa ukuba inkqubo yokupakishwa kwe-semiconductor ihlangabezana neemfuno eziphezulu, ezi ngongoma zokulawula umgangatho zilandelayo kufuneka zifakwe.
1. Qinisekisa ngokuchanekileyo imodeli yamacandelo e-semiconductor structural components.Isakhiwo semveliso yee-semiconductors sinzima.Ukufezekisa injongo yokupakisha ngokuchanekileyo izixhobo zenkqubo ye-semiconductor, kubalulekile ukuqinisekisa ngokungqongqo iimodeli kunye neenkcukacha zamacandelo e-semiconductor.Njengenxalenye yeshishini, abasebenzi bokuthenga kufuneka baphonononge ngokucokisekileyo iimodeli ze-semiconductor ukuphepha iimpazamo kwiimodeli zamacandelo athengiweyo.Ngexesha lokudibanisa ngokubanzi kunye nokutywinwa kweengxenye zesakhiwo se-semiconductor, abasebenzi bezobugcisa kufuneka baqinisekise ukuba iimodeli kunye neenkcukacha zamacandelo zitshekishwa kwakhona ukuze zihambelane ngokuchanekileyo iimodeli ezahlukeneyo zamacandelo e-semiconductor structural components.
2 Yazisa ngokupheleleyo iinkqubo zokupakisha ezizenzekelayo.Imigca yemveliso yokupakishwa kwemveliso ezenzekelayo ngoku isetyenziswa ngokubanzi kumashishini e-semiconductor.Ngokuziswa ngokubanzi kwemigca yokuvelisa ukupakisha ngokuzenzekelayo, iinkampani zokuvelisa zinokuphuhlisa iinkqubo zokusebenza ezipheleleyo kunye nezicwangciso zokulawula, ziqinisekisa ulawulo lomgangatho ngexesha lesigaba sokuvelisa kunye nokulawula ngokufanelekileyo iindleko zabasebenzi.Abasebenzi kwiinkampani zokuvelisa i-semiconductor kufuneka bakwazi ukubeka iliso kunye nokulawula imigca yokuvelisa ukupakisha ngokuzenzekelayo ngexesha langempela, ukuqonda inkqubela ecacileyo yenkqubo nganye, ukuphucula ngakumbi idatha yolwazi oluthile, kunye nokuphepha ngokufanelekileyo iimpazamo kwinkqubo yokupakisha ngokuzenzekelayo.
3. Ukuqinisekisa ukuthembeka kwecandelo le-semiconductor ukupakishwa kwangaphandle.Ukuba ukupakishwa kwangaphandle kweemveliso ze-semiconductor zonakalisiwe, ukusebenza okuqhelekileyo kwee-semiconductors akunakusetyenziswa ngokupheleleyo.Ngoko ke, abasebenzi bezobugcisa kufuneka bahlole ngokucokisekileyo ukunyaniseka kwepakethe yangaphandle ukukhusela umonakalo okanye ukubola okukhulu.Ulawulo lomgangatho kufuneka luphunyezwe kuyo yonke inkqubo, kwaye iteknoloji ephezulu kufuneka isetyenziswe ukujongana nemiba yesiqhelo ngokweenkcukacha, ukujongana neengxaki ezisisiseko kwiingcambu zabo.Ukongezelela, ngokusebenzisa iindlela zokufumanisa ezikhethekileyo, abasebenzi bezobugcisa banokuqinisekisa ngokufanelekileyo ukutywinwa okulungileyo kwee-semiconductors, ukwandisa ubomi benkonzo yezixhobo ze-semiconductor, ukwandisa uluhlu lwesicelo, kunye nefuthe elibi kakhulu ekutshaleni nasekuphuhliseni kwintsimi.
4. Ukwandisa ukuqaliswa kunye nokusetyenziswa kobuchwepheshe bale mihla.Oku kubandakanya ukuphonononga ukuphuculwa kwenkqubo yokupakisha ye-semiconductor kunye namanqanaba obugcisa.Ukuphunyezwa kwale nkqubo kubandakanya amanyathelo okusebenza amaninzi kwaye ijongene nemiba eyahlukeneyo enempembelelo ngexesha lesigaba sokwenziwa.Oku akugcini nje ukwandisa ubunzima bokulawulwa komgangatho wenkqubo kodwa kuchaphazela ukusebenza kunye nenkqubela phambili yemisebenzi elandelayo ukuba kukho naliphi na inyathelo eliphathwa kakubi.Ke ngoko, ngexesha lenqanaba lolawulo lomgangatho wenkqubo yokupakishwa kwe-semiconductor, kubalulekile ukwandisa ukuqaliswa kunye nokusetyenziswa kobuchwepheshe bale mihla.Isebe lemveliso kufuneka likubeke phambili oku, linike inkxaso-mali eninzi, kwaye liqinisekise ulungiselelo olucokisekileyo ngexesha lokusetyenziswa kobuchwepheshe obutsha.Ngokwabela abasebenzi abanobuchule kwinyathelo ngalinye lomsebenzi kunye nokuphatha iinkcukacha ngokuqhelekileyo, iingxaki zesiqhelo zinokuphetshwa.Ukusebenza kokuphunyezwa kuqinisekisiwe, kwaye ububanzi kunye nefuthe lobuchwephesha obutsha bandiswa, ukunyusa kakhulu umgangatho wobugcisa benkqubo yokupakisha ye-semiconductor.
Inkqubo yokupakishwa kwe-semiconductor kufuneka iphononongwe kwiimbono ezibanzi nezimxinwa.Kuphela ngokuqonda okupheleleyo kunye nokulawula intsingiselo yayo yonke inkqubo yokusebenza inokuqondwa ngokupheleleyo kunye neengxaki zesiqhelo ezichongiweyo kumanyathelo athile omsebenzi, ngokuqhubekayo ukulawula umgangatho jikelele.Ngesi siseko, ulawulo lweenkqubo zokusika i-chip, iinkqubo ze-chip mounting, iinkqubo ze-welding bonding, iinkqubo zokubumba, iinkqubo emva kokunyanga, iinkqubo zokuvavanya, kunye neenkqubo zokumakisha nazo zinokuqiniswa.Ukujongana nemingeni emitsha, kunokubakho izisombululo kunye nemilinganiselo ethile, kusetyenziswa iteknoloji yanamhlanje ukuphucula ngokufanelekileyo umgangatho wenkqubo kunye namanqanaba obugcisa, kunye nefuthe ekuphuhliseni ukuphumelela kwemimandla ehambelanayo.
Ixesha lokuposa: May-22-2024