Umphambili, ophakathi kunye neziphelo zangasemva zemigca yokuvelisa i-semiconductor
Inkqubo yokwenziwa kwesemiconductor inokwahlulwa ngokwezigaba zibe zithathu:
1) Isiphelo sangaphambili somgca
2) Isiphelo esiphakathi somgca
3) Umva ekupheleni komgca
Singasebenzisa umzekeliso olula njengokwakha indlu ukujonga inkqubo entsonkothileyo yokwenziwa kwetshiphu:
Isiphelo sangaphambili somgca wemveliso sifana nokubeka isiseko kunye nokwakha iindonga zendlu. Kwimveliso ye-semiconductor, eli nqanaba libandakanya ukudala izakhiwo ezisisiseko kunye nee-transistors kwi-silicon wafer.
Amanyathelo aphambili e-FEOL:
1.Ukucoca: Qalisa nge-silicon wafer encinci kwaye uyicoce ukuze ususe nakuphi na ukungcola.
2.I-Oxidation: Khulisa umaleko wesilicon dioxide kwiwafer ukwahlula iindawo ezahlukeneyo zetshiphu.
3.I-Photolithography: Sebenzisa i-photolithography ukuze ubhale iipateni kwi-wafer, ngokufana nokuzoba iiplani ezinokukhanya.
4.Etching: Cofa isilicon dioxide engafunekiyo ukuveza iipateni ezifunekayo.
I-5.Doping: Yazisa ukungcola kwi-silicon ukuguqula iimpawu zayo zombane, ukudala i-transistors, iibhloko ezisisiseko zokwakha nayiphi na i-chip.
Mid End of Line (MEOL): Ukuqhagamshela amaDots
Isiphelo esiphakathi somgca wemveliso sifana nokufaka iingcingo kunye nemibhobho yamanzi endlwini. Eli nqanaba lijolise ekusekeni uxhulumaniso phakathi kwee-transistors ezidalwe kwinqanaba le-FEOL.
Amanyathelo aphambili e-MEOL:
I-1.I-Dielectric Deposition: I-Deposit insulating layers (ebizwa ngokuba yi-dielectrics) ukukhusela i-transistors.
I-2.Ukuqulunqwa koQhagamshelwano: Ifom yoqhagamshelwano ukudibanisa i-transistors komnye nomnye kunye nehlabathi langaphandle.
I-3.I-Interconnect: Yongeza iileyile zetsimbi ukudala iindlela zeempawu zombane, ezifana ne-wiring yendlu ukuqinisekisa amandla angenamthungo kunye nokuhamba kwedatha.
Umva ekupheleni komgca (BEOL): Ukugqiba ukuchukumisa
Umva womva womgca wemveliso ufana nokongeza izinto zokugqibela kwindlu-ukufaka izixhobo, ukupeyinta, kunye nokuqinisekisa ukuba yonke into isebenza. Kwimveliso ye-semiconductor, eli nqanaba libandakanya ukongeza iileyile zokugqibela kunye nokulungiselela i-chip yokupakisha.
Amanyathelo aphambili e-BEOL:
I-1.Ii-Metal Layers ezongezelelweyo: Yongeza iileyile ezininzi zetsimbi ukuze kuphuculwe i-interconnectivity, ukuqinisekisa ukuba i-chip inokusingatha imisebenzi enzima kunye nesantya esiphezulu.
I-2.Passivation: Faka iileyile zokukhusela ukukhusela i-chip kumonakalo wokusingqongileyo.
3.Uvavanyo: I-chip ixhomekeke kuvavanyo olungqongqo ukuqinisekisa ukuba ihlangabezana nazo zonke iinkcukacha.
I-4.Dicing: Sika i-wafer ibe yi-chips nganye, nganye ilungele ukupakishwa kunye nokusetyenziswa kwizixhobo zombane.
I-Semicera ngumenzi okhokelayo we-OEM e-China, ezinikele ekuboneleleni ngexabiso elikhethekileyo kubathengi bethu. Sinikezela ngoluhlu olubanzi lweemveliso kunye neenkonzo ezikumgangatho ophezulu, kubandakanya:
1.CVD SiC Coating(I-Epitaxy, i-CVD-coated-coated parts, i-high-performance coatings ye-semiconductor applications, kunye nokunye)
2.Amacandelo e-CVD SiC Bulk(Amakhonkco e-Etch, amakhonkco okugxila, amacandelo e-SiC yesiko lezixhobo ze-semiconductor, kunye nokunye)
3.I-CVD TaC Coated Parts(I-Epitaxy, ukukhula kwe-wafer ye-SiC, izicelo zobushushu obuphezulu, kunye nokunye)
4.Amacandelo egraphite(Izikhitshane zegraphite, iinxalenye zegraphite zesiko lokulungiswa kobushushu obuphezulu, kunye nokunye)
5.Amacandelo eSiC(Izikhephe zeSiC, iityhubhu zeSiC zomlilo, amacandelo eSiC esiko okulungisa imathiriyeli ephucukileyo, nokunye)
6.Amacandelo eQuartz(Izikhephe zeQuartz, iinxalenye zequartz zesiko le-semiconductor kunye namashishini elanga, kunye nokunye)
Ukuzibophelela kwethu ekugqweseni kuqinisekisa ukuba sibonelela ngezisombululo ezitsha nezithembekileyo kumashishini ahlukeneyo, kubandakanywa ukwenziwa kwe-semiconductor, ukusetyenzwa kwezinto eziphambili, kunye nokusetyenziswa kobuchwepheshe obuphezulu. Ngokugxininisa ngokuchanekileyo kunye nomgangatho, sizinikele ekuhlangabezaneni neemfuno ezizodwa zomthengi ngamnye.
Ixesha lokuposa: Dec-09-2024