Isiphelo sangaphambili somgca wemveliso sifana nokubeka isiseko kunye nokwakha iindonga zendlu. Kwimveliso ye-semiconductor, eli nqanaba libandakanya ukudala izakhiwo ezisisiseko kunye nee-transistors kwi-silicon wafer.
Amanyathelo aphambili e-FEOL:
1. Ukucoca:Qala nge-silicon wafer encinci kwaye uyicoce ukususa nakuphi na ukungcola.
2. Ukwenziwa kweOxidation:Khulisa umaleko wesilicon diokside kwiwafer ukwahlula iindawo ezahlukeneyo zetshiphu.
3. I-Photolithography:Sebenzisa ifotografi ukukrola iipatheni kwi-wafer, ngokufana nokuzoba iiblueprints ngokukhanya.
4. Etching:Cofa isilicon dioxide engafunekiyo ukuveza iipateni ezifunekayo.
5. Doping:Yazisa ukungcola kwi-silicon ukuguqula iimpawu zayo zombane, ukudala ii-transistors, iibhloko ezisisiseko zokwakha nayiphi na i-chip.
Mid End of Line (MEOL): Ukuqhagamshela amaDots
Isiphelo esiphakathi somgca wemveliso sifana nokufaka iingcingo kunye nemibhobho yamanzi endlwini. Eli nqanaba lijolise ekusekeni uxhulumaniso phakathi kwee-transistors ezidalwe kwinqanaba le-FEOL.
Amanyathelo aphambili e-MEOL:
1. I-Dielectric Deposition:Idiphozithi yokukhusela i-insulating layers (ebizwa ngokuba yi-dielectrics) ukukhusela ii-transistors.
2. Ulwakhiwo loQhagamshelwano:Yenza abafowunelwa ukudibanisa i-transistors enye kwenye kunye nehlabathi langaphandle.
3. Uqhagamshelwano:Yongeza iileya zetsimbi ukwenza iindlela zemiqondiso yombane, efana nocingo lwendlu ukuqinisekisa amandla angenamthungo kunye nokuhamba kwedatha.
Umva ekupheleni komgca (BEOL): Ukugqiba ukuchukumisa
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Umva womva womgca wemveliso ufana nokongeza izinto zokugqibela kwindlu-ukufaka izixhobo, ukupeyinta, kunye nokuqinisekisa ukuba yonke into isebenza. Kwimveliso ye-semiconductor, eli nqanaba libandakanya ukongeza iileyile zokugqibela kunye nokulungiselela i-chip yokupakisha.
Amanyathelo aphambili e-BEOL:
1. Iileya zeMetal ezongezelelweyo:Yongeza iileya ezininzi zetsimbi ukuqinisa unxibelelwano, ukuqinisekisa ukuba i-chip inokusingatha imisebenzi enzima kunye nesantya esiphezulu.
2. Ukunyusa:Faka iileya zokukhusela ukukhusela i-chip kumonakalo wokusingqongileyo.
3. Uvavanyo:Ngenisa itshiphu kuvavanyo olungqongqo ukuqinisekisa ukuba iyahlangabezana nazo zonke iinkcukacha.
4. Ukudayiva:Sika iwafer ibe ziitshiphusi ezizimeleyo, nganye ilungele ukupakishwa kunye nokusetyenziswa kwizixhobo zombane.
Ixesha lokuposa: Jul-08-2024