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Kutheni izixhobo zeSemiconductor zifuna "i-Epitaxial Layer"
Imvelaphi yegama elithi "Epitaxial Wafer" Ukulungiswa kwe-Wafer kunamanyathelo amabini aphambili: ukulungiswa kwe-substrate kunye nenkqubo ye-epitaxial. I-substrate yenziwe nge-semiconductor enye ye-crystal material kwaye isetyenziselwa ukuvelisa izixhobo ze-semiconductor. Isenokwenza i-epitaxial pro...Funda ngokugqithisileyo -
Yintoni iSilicon Nitride Ceramics?
I-Silicon nitride (Si₃N₄) iiseramics, njengeeseramics eziphucukileyo zolwakhiwo, zineempawu ezibalaseleyo ezifana nokumelana nobushushu obuphezulu, ukomelela okuphezulu, ukuqina okuphezulu, ubulukhuni obuphezulu, ukuxhathisa kokuhamba, ukumelana ne-oxidation, kunye nokumelana nokunxiba. Ukongeza, banikezela ngezinto ezintle ...Funda ngokugqithisileyo -
I-SK Siltron ifumana imali-mboleko yezigidi ezingama-544 zeedola kwi-DOE yokwandisa imveliso ye-silicon carbide wafer
ISebe lezaMandla lase-US (i-DOE) kutshanje livume i-544 yezigidi mboleko (kubandakanywa ne-$ 481.5 yezigidi kwinqununu kunye ne-$ 62.5 yezigidi kwinzala) ku-SK Siltron, umenzi we-semiconductor wafer phantsi kwe-SK Group, ukuxhasa ukwandiswa kwayo kwe-silicon carbide ephezulu (SiC). ...Funda ngokugqithisileyo -
Yintoni inkqubo ye-ALD (i-Atomic Layer Deposition)
I-Semicera ALD Susceptors: Ukwenza i-Atomic Layer Deposition ngokuchaneka kunye nokuthembeka kwe-Atomic Layer Deposition (ALD) yindlela yokusika enikezela ngokuchaneka kwe-atomic-scale yokufakela iifilimu ezibhityileyo kumashishini ahlukeneyo obuchwepheshe obuphezulu, kubandakanya i-elektroniki, amandla,...Funda ngokugqithisileyo -
UNdwendwelo lweSemicera lweSemicera oluvela kuMthengi weShishini we-LED waseJapan ukuya kuBonisa umgca weMveliso
I-Semicera iyavuya ukwazisa ukuba sisandula ukwamkela igqiza elivela kumvelisi ophambili waseJapan waseJapan kukhenketho lomgca wethu wemveliso. Olu tyelelo lubonisa intsebenziswano ekhulayo phakathi kweSemicera kunye neshishini le-LED, njengoko siqhubeka nokubonelela ngekhwalithi ephezulu, ...Funda ngokugqithisileyo -
Isiphelo sangaphambili somgca (FEOL): Ukubeka iSiseko
Umphambili, umbindi kunye neziphelo zemigca yokuvelisa i-semiconductor Inkqubo yokwenziwa kwe-semiconductor inokwahlulwa ngokwezigaba ngokwezigaba ezithathu:1) Isiphelo sangaphambili somgca2) Isiphelo esiphakathi somgca3) Isiphelo esingasemva somgca Singasebenzisa isifaniso esilula njengokwakha indlu. ukujonga inkqubo entsonkothileyo...Funda ngokugqithisileyo -
Ingxoxo emfutshane malunga nenkqubo yokwaleka photoresist
Iindlela zokwaleka zefotoresist zidla ngokuhlulwa zibe yi-spin coating, idiphu yokwaleka kunye ne-roll coating, phakathi kwayo i-spin coating isetyenziswa kakhulu. Ngokugquma i-spin, i-photoresist ithontsizwa kwi-substrate, kwaye i-substrate inokujikelezwa ngesantya esiphezulu ukuze i-obtai ...Funda ngokugqithisileyo -
I-Photoresist: izinto eziphambili ezinemiqobo ephezulu yokungena kwi-semiconductors
Ifotoresist okwangoku isetyenziswa ngokubanzi ekusetyenzweni nasekuveliseni iisekethe zemizobo entle kwishishini lolwazi lwe-optoelectronic. Iindleko zenkqubo ye-photolithography i-akhawunti malunga ne-35% yenkqubo yonke yokuvelisa i-chip, kwaye ixesha lokusetyenziswa libalelwa kwi-40% ukuya kwi-60 ...Funda ngokugqithisileyo -
Ukungcoliswa komphezulu we-wafer kunye nendlela yokufumanisa
Ukucoceka komphezulu we-wafer kuya kuchaphazela kakhulu izinga lokufaneleka kweenkqubo ezilandelayo ze-semiconductor kunye neemveliso. Ukuya kuthi ga kwi-50% yazo zonke iilahleko zesivuno zibangelwa kukungcoliseka komphezulu we-wafer. Izinto ezinokubangela utshintsho olungalawulwayo kwi-perf yombane...Funda ngokugqithisileyo -
Uphando kwi-semiconductor die bonding inkqubo kunye nezixhobo
Uphononongo ngenkqubo yokudibanisa i-semiconductor die, kuquka inkqubo yokuncamathela encamatheleyo, inkqubo ye-eutectic bonding, inkqubo yokudibanisa i-solder ethambileyo, inkqubo yokudibanisa isilivere yesilivere, inkqubo yokudibanisa eshushu, inkqubo ye-flip chip bonding. Iintlobo kunye nezalathi ezibalulekileyo zobugcisa ...Funda ngokugqithisileyo -
Funda malunga ne-silicon nge-(TSV) kunye neglasi nge-(TGV) iteknoloji kwinqaku elinye
Itekhnoloji yokupakisha yenye yezona nkqubo zibaluleke kakhulu kwishishini le-semiconductor. Ngokwemilo yephakheji, inokwahlulwa ibe yiphakheji yesokhethi, iphakheji ye-socket, iphakheji ye-BGA, iphakheji yesayizi ye-chip (CSP), iphakheji yemodyuli ye-chip enye (SCM, isithuba phakathi kwe-wiring kwi ...Funda ngokugqithisileyo -
I-Chip Manufacturing: I-Etching Equipment kunye neNkqubo
Kwinkqubo yokuvelisa i-semiconductor, iteknoloji ye-etching yinkqubo ebalulekileyo esetyenziselwa ukususa ngokuchanekileyo izinto ezingafunekiyo kwi-substrate ukwenza iipatheni zesekethe eziyinkimbinkimbi. Eli nqaku liza kwazisa iitekhnoloji ezimbini eziphambili zetekhnoloji ngokweenkcukacha - ngokudibeneyo iplasma...Funda ngokugqithisileyo