I-Semicera's LiNbO3 Bonding Wafer yenzelwe ukuhlangabezana neemfuno eziphezulu zokwenziwa kwe-semiconductor ephezulu. Ngeempawu zayo ezikhethekileyo, kubandakanywa ukumelana nokunxiba okuphezulu, ukuzinza okuphezulu kwe-thermal, kunye nococeko olubalaseleyo, esi siqwenga silungele ukusetyenziswa kwizicelo ezifuna ukuchaneka kunye nokusebenza ixesha elide.
Kwishishini le-semiconductor, ii-LiNbO3 Bonding Wafers ziqhele ukusetyenziselwa ukudibanisa iileya ezibhityileyo kwizixhobo ze-optoelectronic, izinzwa, kunye nee-ICs eziphambili. Baxabiswa ngokukodwa kwi-photonics kunye ne-MEMS (i-Micro-Electromechanical Systems) ngenxa yeempawu zabo ze-dielectric ezigqwesileyo kunye nokukwazi ukumelana neemeko zokusebenza ezinzima. I-Semicera's LiNbO3 Bonding Wafer yenzelwe ukuxhasa ikhonkco echanekileyo yomaleko, iphucula ukusebenza ngokubanzi kunye nokuthembeka kwezixhobo ze-semiconductor.
Iipropati ze-Thermal kunye nombane ze-LiNbO3 | |
Indawo yokunyibilika | 1250 ℃ |
Ubushushu beCurie | 1140 ℃ |
I-Thermal conductivity | 38 W/m/K @ 25 ℃ |
I-Coefficient yokwandiswa kwe-thermal (@ 25°C) | //a, 2.0×10-6/K //c, 2.2×10-6/K |
Ukuxhathisa | 2×10-6Ω·cm @ 200 ℃ |
I-Dielectric rhoqo | εS11/ε0=43, εT11/ε0=78 εS33/ε0=28, εT33/ε0= 2 |
I-piezoelectric rhoqo | D22=2.04×10-11C/N D33=19.22×10-11C/N |
I-Electro-optic coefficient | γT33=32 pm/V, γS33= 31pm/V, γT31=10 pm/V, γS31= 8.6 pm/V, γT22=6.8 pm/V, γS22= 3.4 pm/V, |
Isiqingatha sombane wamaza, DC | 3.03 KV 4.02 KV |
Eyenziwe ngokusetyenziswa kwezinto ezisemgangathweni ophezulu, i-LiNbO3 Bonding Wafer iqinisekisa ukuthembeka okuhambelanayo naphantsi kweemeko ezinzima. Ukuzinza kwayo okuphezulu kwe-thermal kwenza ukuba ifaneleke ngokukodwa kwiindawo ezibandakanya ukushisa okuphezulu, njengazo zifunyenwe kwiinkqubo ze-semiconductor epitaxy. Ukongeza, ukucoceka okuphezulu kwe-wafer kuqinisekisa ukungcoliseka okuncinci, kuyenza ibe lukhetho oluthembekileyo kwizicelo ezibalulekileyo ze-semiconductor.
Kwi-Semicera, sizimisele ukubonelela ngezisombululo ezihamba phambili kwishishini. I-LiNbO3 yethu ye-Bonding Wafer inikezela ukuqina okungahambelaniyo kunye nobuchule bokusebenza okuphezulu kwizicelo ezifuna ukucoceka okuphezulu, ukumelana nokunxiba, kunye nokuzinza kwe-thermal. Nokuba yeyemveliso ye-semiconductor ephucukileyo okanye obunye ubuchwephesha obukhethekileyo, esi siqwengana sisebenza njengenxalenye ebalulekileyo yokwenziwa kwesixhobo esibukhali.