Izixhobo ze-Laser microjet cutting (LMJ) zingasetyenziswa kwishishini le-semiconductor

Inkcazelo emfutshane:

I-Laser microjet technology (LMJ) yindlela yokucubungula i-laser edibanisa i-laser kunye nejethi yamanzi "encinci njengeenwele", kwaye iqondise ngokuchanekileyo i-laser beam kwindawo yokucubungula nge-pulse total reflection in the micro-water jet ngendlela. iyafana nefiber yemveli. Ijethi yamanzi ngokuqhubekayo ipholisa indawo yokusika kwaye isuse ngokufanelekileyo i-debris processing.

Thumela i-imeyile kuthi

Iinkcukacha zeMveliso

Iithegi zeMveliso

Izinto eziluncedo zokusetyenzwa kwe-LMJ

Iziphene zendalo zokusetyenzwa kwelaser rhoqo zinokoyiswa ngokusetyenziswa ngobuchule kwe-laser Laser micro jet (LMJ) itekhnoloji yokusasaza iimpawu zamanzi nomoya. Le teknoloji ivumela i-laser pulses ibonakaliswe ngokupheleleyo kwijethi yamanzi ecocekileyo esetyenzisiweyo ngendlela engaphazamisekiyo ukuze ifike kumphezulu we-machining njenge-fiber optical.

Iimpawu eziphambili zetekhnoloji ye-LMJ zezi:

1. I-laser beam yi-columnar (i-parallel) isakhiwo.

2. I-laser pulse ihanjiswa kwijethi yamanzi njenge-fiber optical, ngaphandle kokuphazamiseka kokusingqongileyo.

3. I-laser beam igxininiswe kwisixhobo se-LMJ, kwaye ukuphakama kwendawo echongiweyo ayitshintshi ngexesha lenkqubo yonke yokucubungula, ngoko ke akufuneki ukuba iqhubeke igxininise kunye nokuguqulwa kobunzulu bokucubungula ngexesha lokucubungula.

4. Coca umphezulu ngokuqhubekayo.

i-micro-jet laser cutting technolgoy (1)

5. Ukongeza ekukhutshweni kwezinto zokusebenza nge-laser pulse nganye, ixesha ngalinye leyunithi ukusuka ekuqaleni kwe-pulse nganye ukuya kwi-pulse elandelayo, izinto ezicutshungulwayo zikwisimo samanzi sokupholisa sangempela malunga ne-99% yexesha. , ephantse isuse indawo echaphazelekayo yokushisa kunye ne-remelt layer, kodwa igcina ukusebenza kakuhle kokulungiswa.

Iinkcukacha ngokubanzi	I-LCSA-100	I-LCSA-200
Umthamo we-countertop	125 x 200 x 100	460×460×300
Umgca ohamba ngomgca XY	Injini yomgca. Injini yomgca	Injini yomgca. Injini yomgca
Umgca ohamba ngomgca ongu-Z	100	300
Ukubeka ukuchaneka μm	+/ - 5	+/- 3
Ukuchaneka kokubekwa okuphindaphindiweyo μm	+/- 2	+/- 1
Ukukhawuleza G	0.5	1
Ulawulo lwamanani	I-3-axis	I-3-axis
Laser
Uhlobo lweLaser	DPSS Nd: YAG	DPSS Nd: YAG, ukubetha
Ubude bobude nm	532/1064	532/1064
Amandla alinganisiweyo W	50/100/200	200/400
Ijethi yamanzi
Umbhobho wedayamitha μm	25-80	25-80
Ibha yoxinzelelo lweNozzle	100-600	0-600
Ubungakanani / Ubunzima
Imilinganiselo (Umatshini) (W x L x H)	1050 x 800 x 1870	1200 x 1200 x 2000
Imilinganiselo (ikhabhathi yolawulo) (W x L x H)	700 x 2300 x 1600	700 x 2300 x 1600
Ubunzima (izixhobo) kg	1170	2500-3000
Ubunzima (ikhabhinethi yokulawula) kg	700-750	700-750
Ukusetyenziswa kwamandla ngokubanzi
Input	I-AC 230 V + 6%/ -10%, i-unidirectional 50/60 Hz ± 1%	AC 400 V + 6%/-10%, 3-phase50/60 Hz ±1%
Ixabiso eliphezulu	2.5kVA	2.5kVA
Joyile	I-10 m intambo yamandla: P + N + E, 1.5 mm2	I-10 m intambo yamandla: P + N + E, 1.5 mm2
Uluhlu lwesicelo somsebenzisi kwishishini leSemiconductor	≤4 intshi ezingqukuva ≤4 intshi ze-ingot izilayi ≤4 i-intshi ze-ingot scribing	≤6 intshi ezingqukuva ≤6 izilayi ze-ingot intshi ≤6 i-intshi ze-ingot scribing Umatshini udibana ne-8-intshi yesetyhula / ukusika / ukusika ixabiso lethiyori, kwaye iziphumo ezithile ezibonakalayo kufuneka ziphuculwe isicwangciso sokusika.