I-Semicera's 6-intshi ye-LiNbO3 Bonding Wafer yenzelwe ukuhlangabezana nemigangatho engqongqo yeshishini le-semiconductor, inikezela ukusebenza okungenakulinganiswa kuzo zombini iindawo zophando kunye nemveliso. Nokuba yeyomgangatho ophezulu we-optoelectronics, i-MEMS, okanye ukupakishwa kwe-semiconductor ephezulu, le wafer yokudibanisa ibonelela ngokuthembeka kunye nokuqina okuyimfuneko kuphuhliso lwetekhnoloji yokusika.
Kwishishini le-semiconductor, i-6-intshi ye-LiNbO3 ye-Bonding Wafer isetyenziselwa ngokubanzi ukudibanisa iileyile ezincinci kwizixhobo ze-optoelectronic, i-sensors, kunye ne-microelectromechanical systems (MEMS). Iimpawu zayo ezikhethekileyo zenza ukuba ibe yinto exabisekileyo kwizicelo ezifuna ukudityaniswa komgangatho ochanekileyo, njengokwenziwa kweesekethe ezidibeneyo (ICs) kunye nezixhobo zefotonic. Ukucoceka okuphezulu kwe-wafer kuqinisekisa ukuba imveliso yokugqibela igcina ukusebenza kakuhle, ukunciphisa umngcipheko wongcoliseko onokuchaphazela ukuthembeka kwesixhobo.
Iipropati ze-Thermal kunye nombane ze-LiNbO3 | |
Indawo yokunyibilika | 1250 ℃ |
Ubushushu beCurie | 1140 ℃ |
I-Thermal conductivity | 38 W/m/K @ 25 ℃ |
I-Coefficient yokwandiswa kwe-thermal (@ 25°C) | //a, 2.0×10-6/K //c, 2.2×10-6/K |
Ukuxhathisa | 2×10-6Ω·cm @ 200 ℃ |
I-Dielectric rhoqo | εS11/ε0=43, εT11/ε0=78 εS33/ε0=28, εT33/ε0= 2 |
I-piezoelectric rhoqo | D22=2.04×10-11C/N D33=19.22×10-11C/N |
I-Electro-optic coefficient | γT33=32 pm/V, γS33= 31pm/V, γT31=10 pm/V, γS31= 8.6 pm/V, γT22=6.8 pm/V, γS22= 3.4 pm/V, |
Isiqingatha sombane wamaza, DC | 3.03 KV 4.02 KV |
I-6-intshi ye-LiNbO3 ye-Bonding Wafer evela kwi-Semicera yenzelwe ngokukodwa usetyenziso oluphezulu kwi-semiconductor kunye ne-optoelectronics industries. Eyaziwayo ngokuxhathisa ukunxiba okuphezulu, ukuzinza okuphezulu kwe-thermal, kunye nokucoceka okukhethekileyo, le wafer ye-bonding ifanelekile kwi-high-performance semiconductor production, inikezela ukuthembeka okuhlala ixesha elide kunye nokuchaneka nakwiimeko ezinzima.
Eyenziwe ngeteknoloji yokusika, i-6-intshi ye-LiNbO3 Bonding Wafer iqinisekisa ukungcoliseka okuncinci, okubalulekileyo kwiinkqubo zokuvelisa i-semiconductor ezifuna amanqanaba aphezulu okucoceka. Ukuzinza kwayo okuhle kakhulu kwe-thermal kuvumela ukuba imelane namaqondo okushisa aphakamileyo ngaphandle kokuphazamisa ingqibelelo yesakhiwo, okwenza kube yinto ethembekileyo yokukhetha izicelo zokubopha ubushushu obuphezulu. Ukongeza, ukuxhathisa okugqwesileyo kwe-wafer kuqinisekisa ukuba isebenza ngokungaguqukiyo kusetyenziso olwandisiweyo, ibonelela ngokuqina kwexesha elide kunye nokunciphisa imfuno yokutshintshwa rhoqo.