Semicerangokuzingca yazisa yayoI-4" i-Gallium oxide Substrates, Isixhobo esiqhekezayo esenzelwe ukuhlangabezana neemfuno ezikhulayo zezixhobo eziphezulu ze-semiconductor. IGallium oxide (Ga2O3) ii-substrates zinika i-ultra-wide bandgap, ezenza zilungele isizukulwana esilandelayo sombane wamandla, ii-optoelectronics ze-UV, kunye nezixhobo ze-frequency ephezulu.
Ezona mpawu:
• I-Ultra-Wide Bandgap: II-4" i-Gallium oxide Substratesziqhayise nge-bandgap emalunga ne-4.8 eV, evumela amandla ombane akhethekileyo kunye nokunyamezela ubushushu, ngokubonakalayo ukodlula imathiriyeli yesiqhelo ye-semiconductor efana nesilicon.
•Ukuqhekeka okuphezulu kweVoltage: Ezi substrates zenza ukuba izixhobo zisebenze kumbane ophezulu kunye namandla, zizenza zigqibelele usetyenziso olunombane ophezulu kumbane wombane.
•Uzinzo oluPhezulu lweThermal: I-Gallium Oxide substrates inikezela nge-conductivity egqwesileyo ye-thermal, iqinisekisa ukusebenza okuzinzile phantsi kweemeko ezinzima, ezilungele ukusetyenziswa kwiindawo ezifunwayo.
•Umgangatho Wezinto Eziphezulu: Ngoxinano oluphantsi kunye nomgangatho ophezulu wekristale, ezi substrates ziqinisekisa ukusebenza okuthembekileyo kunye nokungaguquguqukiyo, ukuphucula ukusebenza kunye nokuqina kwezixhobo zakho.
•Usetyenziso Oluguquguqukayo: Ifanelekile kuluhlu olubanzi lwezicelo, kubandakanywa i-transistors yamandla, i-Schottky diodes, kunye nezixhobo ze-UV-C ze-LED, ezenza ukuba izinto ezintsha zibe namandla kunye ne-optoelectronic fields.
Phonononga ikamva letekhnoloji ye-semiconductor ngeSemicera'sI-4" i-Gallium oxide Substrates. Ii-substrates zethu zenzelwe ukuxhasa ezona zicelo ziphezulu, zibonelela ngokuthembeka kunye nokusebenza kakuhle okufunekayo kwizixhobo zanamhlanje ezinqamlezileyo. Themba iSemicera ngomgangatho kunye nokutsha kwizinto zakho ze-semiconductor.
Izinto | Imveliso | Uphando | Dummy |
Iiparamitha zeCrystal | |||
Iipolytype | 4H | ||
Imposiso yokuma kumphezulu | <11-20>4±0.15° | ||
Iiparamitha zoMbane | |||
I-Dopant | n-uhlobo lweNitrojeni | ||
Ukuxhathisa | 0.015-0.025ohm · cm | ||
Iiparamitha zoomatshini | |||
Ububanzi | 150.0±0.2mm | ||
Ukutyeba | 350±25 μm | ||
Ukuqhelaniswa neflethi ephambili | [1-100] ± 5 ° | ||
Ubude beflethi bokuqala | 47.5±1.5mm | ||
Iflethi yesibini | Akukho nanye | ||
TTV | ≤5 μm | ≤10 μm | ≤15 μm |
LTV | ≤3 μm(5mm*5mm) | ≤5 μm(5mm*5mm) | ≤10 μm(5mm*5mm) |
Ukuqubuda | -15μm ~ 15μm | -35μm ~ 35μm | -45μm ~ 45μm |
I-Wap | ≤35 μm | ≤45 μm | ≤55 μm |
Ngaphambili(Si-face) uburhabaxa(AFM) | Ra≤0.2nm (5μm*5μm) | ||
Ulwakhiwo | |||
Ukuxinana kweMibhobho | <1 iya/cm2 | <10 i/cm2 | <15 i/cm2 |
Ukungcola kwesinyithi | ≤5E10athom/cm2 | NA | |
I-BPD | ≤1500 i-ea/cm2 | ≤3000 nge-cm2 | NA |
TSD | ≤500 i/cm2 | ≤1000 nge-cm2 | NA |
Umgangatho wangaphambili | |||
Ngaphambili | Si | ||
Ukugqitywa komphezulu | Si-ubuso CMP | ||
Amacandelo | ≤60ea/wafer (ubukhulu≥0.3μm) | NA | |
Imikrwelo | ≤5ea/mm. Ubude obongezelekayo ≤Ububanzi | Ubude obongezelekayo≤2*Ububanzi | NA |
Amaxolo e-orenji/imingxuma/amabala/imivimbo/ iintanda/ungcoliseko | Akukho nanye | NA | |
Iitshiphusi ze-Edge/i-idents/fracture/hex plates | Akukho nanye | ||
Iindawo zePolytype | Akukho nanye | Indawo eyongezelekayo≤20% | Indawo eyongezelekayo≤30% |
Ukumakishwa kwelaser yangaphambili | Akukho nanye | ||
Umgangatho wasemva | |||
Emva kokugqiba | C-ubuso CMP | ||
Imikrwelo | ≤5ea/mm,Ubude obongezelekayo≤2*Ububanzi | NA | |
Iziphene zangasemva (iitshiphusi zomphetho/iindindi) | Akukho nanye | ||
Umqolo uburhabaxa | Ra≤0.2nm (5μm*5μm) | ||
Ukumakishwa kwelaser yangasemva | 1 mm (ukusuka kumphetho ophezulu) | ||
Edge | |||
Edge | Chamfer | ||
Ukupakishwa | |||
Ukupakishwa | I-Epi ilungele ukupakishwa kwevacuum Ukupakishwa kweekhasethi ezininzi | ||
*Amanqaku: "NA" ithetha ukuba akukho sicelo Izinto ezingakhankanywanga zinokubhekisa kwi-SEMI-STD. |